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| CAS number | 16887-36-8 |
| Molecular formula | C14H20O2 |
| Product name | 1-ADAMANTYL METHACRYLATE |
| Molecular Structure |  |
Density：1.08 g/cm3
Boiling Point：289.26ºC at 760 mmHg
Flash Point：116.921ºC
CAS No. 16887-36-8 is a type of bisphenol A resin that is thermally resistant and highly transparent. It is used in combination with other resins to manufacture coatings, adhesives, and printing inks. It is also used to produce optical fiber coatings, electrical and electronic boards, and other electrical components.
This particular species of bisphenol A resin has good environmental resistance and excellent thermal stability. It is also known for its opacity and low gas permeability. With its combination of outstanding properties, this resin is often used in conjunction with other specialty resins to produce higher performance coatings and adhesives with improved solvent and temperature resistance.
Bisphenol A resin is best for electronics, electrical, lighting and technical applications. Its unique combination of thermal resistance, optical clarity & chemical and thermal resistance makes this resin a good choice for manufacturing of printed circuit boards, base board, and cable sheathing.
The production process of bisphenol A resin consists of four stages. In the first stage, the raw material, mono- and dihydroxybenzoic acid or phenol, is polymerized with a catalyst such as an aluminum chloride. The second stage is used to match the desired viscosity and molecular weight ranges. In the third stage, the resin is deactivated so that the resin will not cure prematurely. Finally, the resin is cooled and the flow properties are adjusted.
Bisphenol A resin exhibits excellent environmental stress crack resistance, especially at low temperatures due to its low melting point. This type of bisphenol A resin has good flow behavior during application and shows significantly improved electrical properties.
The finished product of bisphenol A resin can be easily applied by spraying, brushing, and dip coating. It is also used for the thermal forming of products and to improve adhesion, strength, and wetting during curing. In addition, bisphenol A resin has the ability to improve coating hardness and abrasion resistance.
